Global Semiconductor Capital Equipment Market 2019-2023| Rising Number of Fabs Drive Growth | Technavio

LONDON–(BUSINESS WIRE)–#Research–Technavio’s global semiconductor capital equipment market research
report projects the market to grow at a CAGR of over 6% during
the forecast period.

The increased need for semiconductor memory devices will be one of the
major trends in the global
semiconductor capital equipment market
during 2019-2023.
The semiconductor device manufacturers have been shifting their focus
from logic, analog, and discrete devices to memory devices such as 3D
NAND and dynamic random-access memory (DRAM). This is primarily because
the growth potential of the semiconductor memory devices market is
considerably higher when compared with other semiconductor device

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market snapshot before purchasing

According to Technavio analysts, one of the key drivers for the global
semiconductor capital equipment market will be the rising number of fabs:

Global semiconductor capital equipment market:
Rising number of fabs

The semiconductor fabs are fabrication plants, which manufacture a range
of semiconductor devices and components. The ICs are either designed
in-house by firms called IDMs or manufactured by foundries as per the
designs provided by clients. The demand for semiconductor components is
increasing due to the increase in the number of applications of various
emerging technologies such as loT and Al.

According to a senior analyst at Technavio for research on semiconductor
equipment, “Several companies are also building new fabs owing to the
highly competitive semiconductor market. They focus on introducing a new
technology before competitors have driven the construction of new fabs.
There will be a need for semiconductor capital equipment due to the
increasing demand for ICs for various emerging applications such as
autonomous cars and robotics.”

Global semiconductor capital equipment market:
Segmentation analysis

This global semiconductor capital equipment market analysis report
provides market segmentation by type (wafer-level manufacturing
equipment, packaging and assembly equipment, and automated test
equipment), and by region (the Americas, APAC, and EMEA). This report
provides an in-depth analysis of the prominent factors influencing the
market, including drivers, opportunities, trends, and industry-specific

Of the three major segments by type, the wafer-level manufacturing
equipment segment held the largest semiconductor capital equipment
market share in 2018, contributing to over 86% of the market. This
segment will dominate the global market throughout the forecast period.

The APAC region held the largest share of the market in 2018, accounting
for close to 71% share. It was followed by the Americas and EMEA
respectively. The APAC region is expected to dominate the market
throughout the period 2019-2023.

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Some of the key topics covered in the report include:

Market Landscape

  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis

Market Sizing

  • Market definition
  • Market size and forecast

Five Forces Analysis

Market Segmentation

Geographical Segmentation

  • Regional comparison
  • Key leading countries

Market Drivers

Market Challenges

Market Trends

Vendor Landscape

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Competitive scenario

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