Cadence Sigrity 2018 Release Accelerates PCB Design Cycles by Integrating 3D Design and 3D Analysis

New 3D Workbench utility bridges PCB design and analysis to optimize
cost and performance of PCB designs

SAN JOSE, Calif.–(BUSINESS WIRE)–Cadence Design Systems, Inc. (NASDAQ:CDNS) today announced its Cadence®
Sigrity 2018 release, which includes new 3D capabilities
that enable PCB design teams to accelerate design cycles while
optimizing cost and performance. A unique, 3D design and 3D analysis
environment integrating Sigrity tools with Cadence Allegro®
technology provides a more efficient and less error-prone solution than
current alternatives utilizing third-party modeling tools, saving days
of design cycle time and reducing risk. In addition, a new 3D Workbench
methodology bridges the gap between the mechanical and electrical
domains, allowing product development teams to analyze signals that
cross multiple boards quickly and accurately. For more information,
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Since many high-speed signals cross PCB boundaries, effective signal
integrity analysis must encompass the signal source and destination die,
as well as the intervening interconnect and return path including
connectors, cables, sockets and other mechanical structures. Traditional
analysis techniques utilize a separate model for each piece of
interconnect and cascade these models together in a circuit simulation
tool, which can be an error-prone process due to the 3D nature of the
transition from the PCB to the connector. In addition, since the 3D
transition can make or break signal integrity, at very high speeds
designers also want to optimize the transition from the connector to the
PCB or the socket to the PCB.

The Sigrity 2018 release enables designers to take a holistic view of
their system, extending design and analysis beyond the package and board
to also include connectors and cables, all of which can impact
optimization of the high-speed interconnect. An integrated 3D design and
3D analysis environment allows PCB design teams to optimize the
high-speed interconnect of PCBs and IC packages in the Sigrity tool and
automatically implement the optimized PCB and IC package interconnect in
Allegro PCB, Allegro Package Designer, or Allegro SiP Layout without the
need to redraw. Until now, this has been an error-prone, manual effort
requiring careful validation. By automating this process, the Sigrity
2018 release reduces risk, saves designers hours of re-drawing and
re-editing and can save days of design cycle time by eliminating editing
errors not found until the prototype reaches the lab. This reduces
prototype iterations and potentially saves hundreds of thousands of
dollars by avoiding re-spins and schedule delays.

A new 3D Workbench utility available with the Sigrity 2018 release
bridges the mechanical components and the electronic design of PCB and
IC packages, allowing connectors, cables, sockets and the PCB breakout
to be modeled as one with no double counting of any of the routing on
the board. Interconnect models are divided at a point where the signals
are more 2D in nature and predictable. By allowing 3D extraction to be
performed only when needed and fast, accurate 2D hybrid-solver
extraction to be performed on the remaining structures before all the
interconnect models are stitched back together, full end-to-end channel
analysis can be performed efficiently and accurately of signals crossing
multiple boards.

In addition, the Sigrity 2018 release offers Rigid-Flex support for
field solvers such as the Sigrity PowerSI® technology,
enabling robust analysis of high-speed signals that pass from rigid PCB
materials to flexible materials. Design teams developing Rigid-Flex
designs can now use the same techniques previously used only on rigid
PCB designs, creating continuity in analysis practices while PCB
manufacturing and material processes continue to evolve.

“At Lite-On, our Storage Business Group (SBG) focuses on solid state
disk enterprise datacenter product design. It has become increasingly
important to consider signal and power integrity on our extremely dense
designs,” said Andy Hsu, Lite-On SBG R&D head. “In order to enhance 2D
layout and 3D connector structure integration, Lite-On SBG has
accelerated our design cycle by adopting the Cadence 3D solutions
including Sigrity PowerSI 3DEM and the Sigrity 3D Workbench, which
support seamless use of Cadence Allegro layout and Sigrity extraction
tools. Our engineers can simulate more accurately and efficiently and
deliver customer-oriented results.”

“The Sigrity 2018 release takes a giant step forward by tightly coupling
technology from multiple product teams at Cadence,” said Tom Beckley,
senior vice president and general manager of the Custom IC & PCB Group
at Cadence. “With the integration of 3D technology from the Allegro and
Sigrity teams, we continue to polish our customers’ path to system
design enablement by enabling them to take a more holistic approach to
product optimization encompassing not only the chip, package and board
but also the mechanical structures.”

About Cadence

Cadence enables electronic systems and semiconductor companies to create
the innovative end products that are transforming the way people live,
work and play. Cadence software, hardware and semiconductor IP are used
by customers to deliver products to market faster. The company’s System
Design Enablement strategy helps customers develop differentiated
products—from chips to boards to systems—in mobile, consumer, cloud
datacenter, automotive, aerospace, IoT, industrial and other market
segments. Cadence is listed as one of Fortune Magazine’s 100 Best
Companies to Work For. Learn more at

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