Toshiba Expands New Packaging Option for SO6L IC-Output Photocouplers

– New products realize direct replacement from current SDIP6(F type)
package products

TOKYO–(BUSINESS WIRE)–Toshiba
Electronic Devices & Storage Corporation
(“Toshiba”) is
expanding its line-up of SO6L IC-output photocouplers with a new wide
leadform package[1] type SO6L(LF4). Shipments start today.


The SO6L(LF4) package has a creepage distance of 8mm, which meets the
industry’s standard creepage distance for SO6L.

To date, Toshiba has offered eight photocouplers in the SO6L(LF4)
package: three for high-speed communication applications and five for
IGBT/MOSFET drive applications. Now the company has added six
photocouplers in the SO6L(LF4) package to its product portfolio: three
for high-speed communication applications and three for IGBT/MOSFET
drive applications.

The SO6L(LF4) package is footprint-compatible with the SDIP6(F type)
package with wide lead-forming option and a maximum package height of
4.15mm. In addition, the SO6L(LF4) package has a maximum height of
2.3mm, which is approximately 45% thinner than the conventional SDIP6(F
type) package. Its low profile package contributes to system size
reduction and can be mounted in height-restricted locations, such as the
back of a board.

Toshiba will release more IC-output photocouplers as direct replacements
for the current SDIP6 (F type) package.

The latest Gartner market report recognizes Toshiba as the leading
manufacturer of optocouplers by sales in 2015 and 2016, with 23% of
sale-based market share in CY2016. (Source: Gartner “Market Share:
Semiconductor Devices and Applications Worldwide 2016” 30 March, 2017)

Toshiba will continue to deliver products that meet the needs of
customers by promoting the development of a diverse portfolio of
photocouplers and photorelays tailored to market trends.

Applications

  • High-speed communication photocoupler
    (Factory networking,
    digital interfaces, I/O interface boards, programmable logic
    controllers (PLCs), intelligent power module drive [2] etc.)
  • IGBT / MOSFET driver photocoupler
    (General-purpose inverters,
    air-conditioner inverters, photovoltaic power inverters, etc.)

Features

  • Package height: 2.3mm (max) [1.85mm lower than SDIP6(F type) (45%
    reduction)]
  • Pin distance [3]: 9.35mm (min) [pin-compatible with SDIP6(F
    type)

Main Specifications

(The characteristic values are guaranteed under temperature ranges shown
below;
@Ta=-40 to 125℃ for TLP2710(LF4), TLP2766A(LF4)
@Ta=-40
to 110℃ for TLP2745(LF4), TLP2748(LF4), TLP5771(LF4), TLP5772(LF4),
TLP5774(LF4)
@Ta=-40 to 100℃ for TLP2719(LF4) )

 

New part

number
[Package: SO6L(LF4)]

 

Current part number
[Package: SDIP6(F type)]

  Applications   Characteristic(new products)

Supply current
ICCH, ICCL
max
(mA)

 

Threshold input
current
(L -> H)
IFLH
max
(mA)

 

Propagation delay time
tpLH, tpHL
max
(ns)

 

Peak output
current
IOPH, IOPL
max
(A)

 

Common-mode
transient immunity
CMH, CML
Min
@Ta=25℃
(kV/μs)

TLP2710(LF4)

High-Speed
Communications

0.3[5] 1.0 250

+/-25

TLP2745(LF4) TLP715F 3 1.6 120

+/-30

TLP2748(LF4) TLP718F 3 1.6[6] 120

+/-25

TLP2719(LF4)[4] TLP719F TBD

800@Ta=25℃

+/-10

TLP2766A(LF4)[4] TLP2766F 3 3.5[6] 40

+/-20

TLP5771(LF4) TLP701AF

IGBT / MOSFET
drive

3 2 150

+/-1

+/-35

TLP5772(LF4) TLP700AF 3 2 150

+/-2.5

+/-35

TLP5774(LF4)  

    3   2   150  

+/-4

 

+/-35

 
Item   Package name
SO6L(LF4)   SDIP6(F type)
Height max (mm) 2.3 4.15
Creepage distances min (mm) 8 8
Clearance distances min (mm) 8 8
Isolation voltage

BVS@Ta=25℃ (kVrms)

  5   5
 

Notes
[1] A package with a longer pin distance than a standard
package.
[2] Applicable part numbers: TLP2710(LF4), TLP2745(LF4),
TLP2748(LF4)
[3] Pin distance: The span between pins on the LED and
the pins on the photodetector.
[4] Under Development
[5] IDDH,
IDDL
[6] IFHL

Follow the link below for more on the new products and Toshiba’s
photocoupler line-up.
https://toshiba.semicon-storage.com/ap-en/product/opto/photocoupler.html

Customer Inquiries:
Optoelectronic Device Sales & Marketing
Dept.
Tel: +81-3-3457-3431
https://toshiba.semicon-storage.com/ap-en/contact.html

Information in this document, including product prices and
specifications, content of services and contact information, is current
on the date of the announcement but is subject to change without prior
notice.

About Toshiba Electronic Devices & Storage Corporation

Toshiba Electronic Devices & Storage Corporation combines the vigor of a
new company with the wisdom of experience. Since becoming an independent
company in July 2017, we have taken our place among the leading general
devices companies, and offer our customers and business partners
outstanding solutions in discrete semiconductors, system LSIs and HDD.

Our 19,000 employees around the world share a determination to maximize
the value of our products, and emphasize close collaboration with
customers to promote co-creation of value and new markets. We look
forward to building on annual sales now surpassing 700-billion yen (US$6
billion) and to contributing to a better future for people everywhere.
Find
out more about us at https://toshiba.semicon-storage.com/ap-en/company.html

Contacts

Media Inquiries:
Toshiba Electronic Devices & Storage
Corporation
Chiaki Nagasawa, +81-3-3457-4963
Digital Marketing
Department
semicon-NR-mailbox@ml.toshiba.co.jp