Global CMP Equipment Market 2017-2021: Analysis By Wafer Size & End User – Research and Markets

CMP Equipment Market 2017-2021”
report has been added to Research
and Markets’

The global CMP equipment market is forecast to grow at a CAGR of 6.71%
during the period 2017-2021.

The report, Global CMP Equipment Market 2017-2021, has been prepared
based on an in-depth market analysis with inputs from industry experts.
The report covers the market landscape and its growth prospects over the
coming years. The report also includes a discussion of the key vendors
operating in this market.

The latest trend gaining momentum in the market is the use of NEMS. NEMS
are devices that integrate electrical and mechanical systems at a
nanoscale. They are the logical next-generation devices after MEMS. They
have a large number of features, such as low power consumption and
production costs because of their small size. NEMS are less than 100nm
in diameter but have a large surface area. This makes them useful for
devices, such as high-frequency resonators and ultrasensitive sensors.
NEMS can be used in a number of devices that include accelerometers,
drug delivery systems, energy harvesters, gyroscopes, and portable power

According to the report, one of the major drivers for this market is the
rising number of fabs. Semiconductor fabs are fabrication plants that
manufacture ICs. These ICs are either designed in-house by IDMs or
manufactured by pureplay foundries as per the designs provided by
clients. Owing to the increasing application of semiconductor components
in various emerging technologies, such as IoT and AI, the need for
silicon wafers to manufacture these components is rising. This is
leading to the increased need to construct more fabs. Many companies are
building new fabs as the semiconductor foundry market is highly
competitive. The race for the introduction of new technologies is also a
factor that is driving the construction of new fabs.

Key vendors

  • Applied Materials
  • Lapmaster

Other prominent vendors

  • Entrepix
  • Revasum

Key Topics Covered:

Part 01: Executive Summary

Part 02: Scope Of The Report

Part 03: Research Methodology

Part 04: Introduction

Part 05: Market Landscape

Part 06: Market Segmentation By Wafer Size

Part 07: Market Segmentation By End-User

Part 08: Geographical Segmentation

Part 09: Key Leading Countries

Part 10: Decision Framework

Part 11: Drivers And Challenges

Part 12: Market Trends

Part 13: Vendor Landscape

Part 14: Key Vendor Analysis

Part 15: Appendix

For more information about this report visit


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Topics: Semiconductor